GENEVA, Oct. 5 -- TOAGOSEI CO., LTD. filed a patent application (JP2026/003749) for “CURABLE COMPOSITION, CURED PRODUCT, HARD COATING AGENT, HARD COATING, ARTICLE, AND LAMINATE”. With publication no. ... Read More
GENEVA, Oct. 5 -- SHIMADZU CORPORATION filed a patent application (JP2026/003831) for “ESTIMATION DEVICE, ESTIMATION METHOD, AND ESTIMATION MARKER”. With publication no. WO/2026/203831, here are the o... Read More
GENEVA, Oct. 5 -- TOKYO SEIMITSU CO., LTD. filed a patent application (JP2026/003678) for “INFORMATION PROCESSING DEVICE, PROBER, AND PROBE CARD REPLACEMENT METHOD”. With publication no. WO/2026/20382... Read More
GENEVA, Oct. 5 -- NORITAKE CO., LIMITED filed a patent application (JP2026/003705) for “NI PASTE FOR GRAVURE PRINTING, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT”. With publication no. WO/2026/... Read More
GENEVA, Oct. 5 -- SONY SEMICONDUCTOR SOLUTIONS CORPORATION filed a patent application (JP2026/003615) for “DA CONVERSION CIRCUIT AND IMAGING DEVICE”. With publication no. WO/2026/203815, here are the ... Read More
GENEVA, Oct. 5 -- SONY SEMICONDUCTOR SOLUTIONS CORPORATION filed a patent application (JP2026/003636) for “DA CONVERSION CIRCUIT, IMAGING DEVICE, AND ELECTRONIC CIRCUIT”. With publication no. WO/2026/... Read More
GENEVA, Oct. 5 -- TOKYO SEIMITSU CO., LTD. filed a patent application (JP2026/003677) for “PROBER AND WAFER TEST SYSTEM”. With publication no. WO/2026/203819, here are the other details related to the... Read More
GENEVA, Oct. 5 -- DAIO PAPER CORPORATION filed a patent application (JP2026/003585) for “CLEANING SHEET”. With publication no. WO/2026/203809, here are the other details related to the patent applicat... Read More
GENEVA, Oct. 5 -- SONY SEMICONDUCTOR SOLUTIONS CORPORATION filed a patent application (JP2026/003596) for “POWER SUPPLY DEVICE AND SEMICONDUCTOR DEVICE”. With publication no. WO/2026/203810, here are ... Read More
GENEVA, Oct. 5 -- PASCAL ENGINEERING CORPORATION filed a patent application (JP2026/003604) for “ROTARY CLAMP DEVICE”. With publication no. WO/2026/203811, here are the other details related to the pa... Read More